Abstract
To fulfil today's thermal and mechanical demands of the automotive manufacturer, a new technology for making electronic circuits using ceramic substrates has been developed. The combination of TFC ® (Thick Film Copper) and standard hybrid technology on the same substrate (Patchwork) allows high density interconnection and controlled thermal management of the power semiconductors. The use of high temperature solder and special designs makes operating temperature ranges between 50°C and +150 ° C possible with a high level of mechanical integrity and long term stability.