Promoting excellence in mobility engineering

  1. FISITA Store
  2. Technical Papers

TTP/C – A Communication Protocol as Enabling Technology for Future Silicon Solutions in Cars
eaec99/sta99c309

Authors

Andreas Krüger - Motorola GmbH
Andreas Both - Motorola GmbH

Abstract

In recent years, a tendency to replace current mechanical or hydraulic subsystems with pure electro-mechanic systems can be observed in the automotive industry. In analogy to the aircraft industry, the term “x-by-wire” is often used for these systems, “x” standing for any particular application such as braking or steering. The communication protocol is one of the key enabling technologies for these systems. The good news for semiconductor companies is that the silicon content will further increase once these systems become a reality, and new, well-tailored system-on-chip solutions will be required.

Add to basket

Back to search results