Abstract
Keywords - IGBT, die bond, low-void soldering, hydrogen-reduction, capillary phenomenon
Abstract - Hybrid vehicles (HV), electric vehicles (EV) and fuel-cell hybrid vehicles (FCHV) use an electric motor as a prime mover. The motor output is controlled by an inverter, which is composed of insulated-gate bipolar transistor (IGBT) devices.
IGBT device generates heat due to conduction resistance and switching loss. The heat is released to the cooler through the solder that attaches IGBT device to the substrate. However, this heat discharge is hampered by voids (air pockets) in the solder.
This paper describes a new innovative soldering method that introduces new concepts such as the capillary phenomenon. This method allows short process time and at the same time is low in void formation.