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New Package-Free Silicon Microsensors for Infrared and Thermal Flow Measurements. Potential Automotive Applications
SENSACT05/1.10_M.Haffar_IEMN

Authors

M. Haffar - Institut d’Electronique de Microélectronique et de Nanotechnologies
M. Yala - Institut d’Electronique de Microélectronique et de Nanotechnologies
K. Ziouche - Institut d’Electronique de Microélectronique et de Nanotechnologies
P.Godts - Institut d’Electronique de Microélectronique et de Nanotechnologies
D. Leclercq - Institut d’Electronique de Microélectronique et de Nanotechnologies

Abstract

Keywords

Temperature measurement , infrared radiation , dirty environment , heat flow microsensor , radiation microsensor

Abstract

In this article, a new family of low-cost microsensors dedicated to the infrared radiation and heat flow measurements is described. These sensors manufactured in Silicon technology are shaped as quasi-monolithic 300 μm thick plates, that confers a very great robustness to them. Areas are ranging between 3x3 mm² and 10x10 mm². The original structure of these microsensors makes it possible to avoid the packaging that notably reduces the manufacturing cost. They can be fixed on surfaces by simple gluing. Some applications and results are described : A thermal microswitch, an exemple of liquid detection by measurement of the evaporation latent heat , and a contactless temperature measurement in dirty environment .

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