Abstract
KEYWORDS – Junction Block, Printed Circuit Board (PCB), Heat flow Simulation, Thermal Distribution, Optimization
ABSTRACT – This study is to develop an engine room junction block heat flow simulation and suggest the optimal PCB patterns and component position. The main object is how to provide design suitability and optimal design to the designer in each design stage using heat flow simulation. In concept design, we create theoretical value using the data sheet to estimate the heat value which is difficult to reflect thermal factor, using the real experimental analysis. In basic design step, perform the simulation for PCB block. It is that effect with component heating on PCB and modeling of PCB pattern. So we analysis it using simulation is considered these factor. In detail design, we perform the junction simulation to estimate the temperature rise and distribution. This step is confirmed that detail design is completed and checking the design by real test. At result, we have developed a mathematical model of heat in a variety of ways, and predicting the temperature increase of the test conditions, determined the effects on system components. Methodology using PCB design information may be conducted quickly and easily. It can be verified thermal weak point of PCB pattern. Designers could have had a short time to check the suitability of the design elements, establish a simulation process to derive optimal designs.