Abstract
In late years, Denso Co., Ltd. advocates Denso Eco vision toward circulated economic social realization to accelerate. Denso tries for a research & development and the sustainable environmental safeguard that aimed at the harmony with the environment. As the environment action plan, we promote the reduction of the CO2 discharge of the prevention of global warming by the energy saving now. We aimed at a part heating hardening (curing) method how we used a semiconductor laser for from the whole heating method how we used a conventional hardening (curing) furnace for as a part of the energy saving activity in the adhesive hardening (curing) process of automobile parts. We built the new processing method of the Denso original by development of the super-high-speed hardening epoxy adhesive and the application development of resin laser welding. As the result, we were able to give energy saving effects more than 95% for conventional hardening (curing) furnace heating. The points of this study are the adhesive material development hardening (curing) by a second unit, and the different kind materials adhesion that it is not possible in the resin laser welding. The former, super-high-speed epoxy adhesive of the second unit combined carbon black as light-heat conversion agent and converted the light of the semiconductor laser into 100% fever by the carbon black. We were able to achieve the thermal energy by using 3 hardening agents different from the conventional hardening agent. The latter, the different kind materials adhesion that it was not possible in conventional resin laser welding, was able to achieve the different kind materials adhesion by irradiating selectively laser beam into this adhesive layer between two pieces of different kind resin materials. Furthermore, we optimized the semiconductor laser condition. As the result, we have developed the world's first laser hardening adhesive technology to find adhesion strength to bulk destruction by the adhesion of engineering resin such as PBT(Poly butylene terephtalate), PPS(Poly phenyl sulfide) in less than 2 seconds.
KEYWORDS - Semiconductor laser, Light-heat conversion, Epoxy adhesive, Laser welding, Egl