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Analysis of Whisker Growth Mechanism in Lead Free Coatings
FISITA2008/F2008-12-060

Authors

Yasufumi Shibata* - Toyota Motor Corporation, Japan
Takashi Nomura - Toyota Motor Corporation, Japan
Mitsuru Sakano - Toyota Motor Corporation, Japan
Shigeru Konda - Toyota Motor Corporation, Japan

Abstract

Keywords:Pb free material, Sn plating, Sn whisker

The root cause of whiskers on the surface of lead free coatings, such as electrical Sn plating requires consideration. Various countermeasures have been discussed and implemented by various industrial fields. However, the root cause is still being discussed by many researchers and industries. This paper describes the formation of filament whiskers, and the crystal structure of these whiskers and plating.

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