Abstract
Humidity represents the amount of water vapour in the atmosphere. Presence of Humidity allows moisture to settle down which slowly can penetrate the Electronic component’s housing and can enter into PCBA. This causes an internal condensation that may lead to electrical sneak paths as well as functional and material degradation. As a result, the functional behavior of electronic components is degraded further reducing the life of component. The objective of the paper is to optimize the ramp rate in Composite Temperature/ Humidity Cyclic test procedure. Issues associated with Humidity can be prevented during validation by adjusting the ramp rate of test profile so as to mitigate the risk of water condensation on the Electronic PCBs. This can be varied based on the Component’s mass/ size. This paper is intended to address the root cause of common Humidity related issues on Electronic Component’s PCBAs, factors leading to that and recommendation for preventing Humidity related failures in Electronic PCBAs. The current study is limited to only Composite Temperature/ Humidity Cyclic test procedure. Major focus is to verify the different ramp rates for various types of components in Lab and provide an optimal ramp rate to avoid formation of water droplets on PCB. Experiment results shows and proves that the optimized Ramp Rate = 2.5 Hrs. is the best for mitigating the risk of Humidity related issues during validation in Electronic components.