Abstract
Keywords:
Die, Bonding, Soldering, Mechatronic, Power, Automotive
Abstract:
This document introduces a new die packaging technology and its associated process for manufacturing automotive power mechatronic applications. The new power mechatronic package is based on Insert Moulded Leadframe (IML) and its associated process for die bonding consists of a new Die Laser Soldering (DLS) approach. This paper explains the technical challenges, the results that were obtained and displays the reliability comparison between the state of the art of die bonding technology and the proposed process innovations. This comparison has been based on automotive representative test samples. A comprehensive analysis of reliability has been made using metallurgical investigations and power cycling on a wide range of die sizes and solder types. The data on such IML packages and Die Laser Soldering (DLS) demonstrate the very great potential of this new technology for automotive power mechatronic modules.