Abstract
Almost all the electronic devices are manufactured by the micro-bonding technology soldering. Soldering of the material used very good terms of rice, junction, tasks and thermal conduction rate, mechanical properties with the quality of Sn-37Pb alloy. However, included Pb in the Sn-Pb solder is known that damage to central nervous system of the human body during accumulated in the body. Because of the inherent toxicity of Pb, studies of Pb-free solder alloys are increasing widely. But reliability data of Pb-free solder alloys is not enough. Therefore, this study was performed to secure reliability of Pb-free solder alloy which is used as soldering material instead of Pb. The micro shearpunch tests was performed to obtain shear properties of Pb-free solder Sn-37Pb, Sn-4Ag and Sn-4Ag- 0.5Cu by temperature were analysed by applying different temperature conditions (30°C, 50°C, 80°C) to the tests. Also, a method which can obtain shear properties of solder alloys easily was proposed. From these processes, difference of shear properties among Sn-37Pb, Sn-4Ag and Sn-4Ag-0.5Cu by temperature condition was analysed and the utility of micro shear punch test was verified. MSC Marc mentat 2005 was used for the FEM analysis. And all boundary conditions and contact conditions were same with the micro shear punch test conditions. When result compare FEM analysis with micro shear punch test, this study can get similarity of data, and obtain reliability about FEM analysis method.
Keywords: Sn-Ag solder, Micro Shear-punch test, FEM, Temperature conditions, Shear properties